LED Modules

This is the most important part of the module and is directly responsible for displaying the image. The number of lamp beads determines the clarity and pixel pitch of the LED display module. LED lamp beads are usually composed of red, green, blue, or more.

PCB refers to a printed circuit board, on which all electronic components (lamp beads, driver ICs, resistors, capacitors, sockets, etc.) are mounted. It provides mechanical support for LED lamp beads.
It provides electrical connections between lamp beads, between lamp beads and driver ICs, and between driver ICs and interfaces.

Driver ICs are integrated circuits and are the core control components of the module. They receive display data from the receiving card. Most modules are driven by dynamic scanning (such as 1/4, 1/8, 1/16 scan, etc.). The driver IC is responsible for lighting up the LEDs row by row or partition in sequence and quickly, using the visual persistence effect of the human eye to form a complete image. The scanning method affects the refresh rate, brightness, power consumption, and cost.

Cables: flat cable and power line. The cables transmit signals and electricity between modules and also connect them.
Rubber ring: For outdoor LED display, the rubber ring can improve waterproof ability by preventing water.
Mask: The black plastic front piece has many holes that match the position of LEDs.

For outdoor screens, the visor-type ledge on each LED can improve its visibility in direct sunlight.

DIP - Dual In-line Package is a single red, green, and blue LED lamp bead with two long pins, which is inserted vertically and soldered on the PCB board. The red, green, and blue lamp beads are arranged separately.
Features:
High brightness: A single lamp bead has high brightness and is suitable for outdoor strong light environment.
Good protection: The surface of the lamp bead is usually protected by an epoxy resin cap, and it has good waterproof and dustproof performance
Low pixel density: The lamp bead is large in size and large in spacing, resulting in low pixel density (the dot spacing is usually above P10), and the graininess is obvious when viewed from a close distance.
Relatively small viewing angle: The light-emitting angle of the lamp bead is usually not as good as SMD.
Slightly worse color: The discreteness of different lamp beads may result in color uniformity that is not as good as SMD.
Application: Mainly used for outdoor display screens with extremely high brightness requirements, long viewing distances, and cost sensitivity

SMD 3-in-1 encapsulates three LED chips of red, green, and blue in a very small plastic bracket to form an independent patch lamp bead (SMD lamp bead). Then, these SMD lamp beads are soldered to the PCB board through surface mounting technology (SMT). This is the mainstream form in the market.
Features:
High pixel density: The lamp beads are small in size and can be arranged very closely to achieve a very small dot pitch (from P1.0 to P10+), which is suitable for close viewing indoors.
Wide viewing angle: Usually has a wider horizontal and vertical viewing angle (up to 160 degrees or more).
Good color uniformity: The red, green, and blue chips are integrated in one lamp bead, the distance is close, the color mixing effect is good, and the color is more uniform and bright.
Protectiveness depends on glue filling: The bare board itself has weak protection, and outdoor applications require glue filling or the installation of a mask/sealed box.
Application: It is the most widely used type at present, covering most indoor display screens (conference rooms, shopping malls, stage backgrounds) and more and more outdoor display screens (especially those with a dot pitch below P4).

GOB refers to glue on board covers the surface of the traditional SMD module with a special transparent optical protective glue.
Features:
Enhanced protection: effectively prevents damage to the lamp beads due to bumps, moisture-proof, dust-proof, anti-oxidation, and anti-static.
Smooth surface: flat and easy to clean.
Improved reliability: reduces the problem of lamp drop and cold soldering.
Cost is lower than COB: based on mature SMD technology, add a glue dispensing link.
Application: various indoor applications that improve protection and reliability based on traditional SMD.

COB means chip on board, directly binds multiple LED chips (bare crystal, without bracket package) to the PCB substrate, and then covers the whole with a layer of fluorescent glue for protection.
Features:
Excellent protection: The entire luminous surface is covered with colloid, which has excellent anti-collision, moisture-proof, dust-proof, anti-static, and anti-oxidation properties.
Good heat dissipation: low thermal resistance and short heat dissipation path.
Smooth surface: no lamp bead granularity, flat touch, easy to clean.
High reliability: no risk of cold soldering and lamp drop of traditional SMD.
High manufacturing cost: complex process.
Difficult maintenance: The repair cost of a single pixel point is high, and the entire module usually needs to be replaced.
Application: Indoor scenes with extremely high requirements for reliability and protection (such as command and control centers, high-end conference rooms), and places that require frequent cleaning.